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| About VIA Embedded - embedded in your success |
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 Throughout the centuries a diamond has always represented sophistication, quality and value. Though small, they carry a high intrinsic value and extremely durable which is at the core of VIA Embedded’s design philosophy and excellence in engineering. VIA is dedication to perfection shines through in the creation of our small footprint core processors and chipsets with optimized performance. VIA’s high quality, reliable and fanless products use minimal power consumption and deliver the highest value to customers.
Each diamond is unique and it takes the precision of an expert craftsman to cut and polish each gem to bring out its true beauty and value. VIA deeply understands the different needs within the embedded market, from the silicon and board level products all the way to system-ready platforms and provides a comprehensive range of integrated solutions and customized services. VIA focuses on the specific needs of its customers and develops tailored OEM/ODM projects to deliver maximum benefit for each unique solution. Our experience and wealth of knowledge allows us to maximize the projects and build in flexibility with pin to pin compatible processors and complimentary add-on boards allowing our customers to easily upgrade without additional time spent in R&D.
VIA believes in delivering tomorrow’s innovation, today, and uses the approach ‘Small is beautiful’ to drive the proliferation of creative products and applications that can enhance individuals experiences with technology and enhance quality of life. |
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| Technology Innovation |
Based on the “Small is Beautiful” strategy, VIA believes that transforming the embedded platform enables developers to deploy systems for their space-efcient embedded design applications. VIA has innovated several small form factors and they are widespread around the world.
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VIA created the Mini-ITX (17 cm x 17 cm), Nano-ITX (12 cm x 12 cm) and Pico-ITX (10 cm x 7.2 cm) in 2002, 2004 and 2007 respectively. The launch of Mini-ITX was proved to be the catalyst for a creative Small Form Factor (SFF). The Mini-ITX was recognized as an industry open standard for small footprint embedded systems. The Nano-ITX and Pico-ITX received the same popularity for even smaller dimension embedded designs. |
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To further expansion on small form factors, VIA collaborated with Small Form Factor Special Interest Group (SFF-SIG) and co-launched the Pico-ITXe form factor in 2008. The Pico-ITXe utilizes the SUMIT interface for modular expansion on its compact size. |
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In March 2009, VIA created the Em-ITX board form factor (17 cm x 12 cm), a board that sports a unique dual-sided I/O coastline and Em-IO expansion interface. At the end of 2009, VIA launched the Mobile-ITX — only 6 cm x 6 cm — enabling x86 processing power in handheld system designs. |
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This new form factor is the smallest existing COM form factor in the world. The total height of the board-to-board connectors is only 3 mm — enabling more possibilities and making it ideal for the lightest, sleekest, and most stylish designs. |
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| System Ready Platforms |
| VIA provides a comprehensive range of platforms with the spectrum of offerings that not only include silicon and board level products, but also system-ready platform solutions for industrial computer, panel PC, digital signage system, networked storage, network appliance, etc. In addition, VIA enables customers to have fast implementation for their projects by providing BTOS (Build to Order Service). Customers are empowered with the ability to customize a configuration from a selection of chassis, boards, components, and parts for their own application-ready system solutions and receive orders more quickly. VIA facilitates the process through optimizing entire value-added options for customers — from product design and development, to production, sales and service. |
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| One Stop Shop Services |
| VIA provides a one-stop-shop experience for products and services spanning a diverse portfolio of silicon, comprehensive software resources, and innovative reference designs that assist developers in getting new products to market quickly and with minimal R&D. VIA provides complete platforms and services by leveraging VIA’s extensive expertise in software engineering, hardware design, and system integration. Moreover, the VIA CPU platform allows more flexibility so customers can easily upgrade without additional time spent in R&D. |
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| Green Computing |
VIA has long been a leading proponent of Green Computing, with a focus on power efficiency throughout the design and manufacturing process since 2001, and is proud to lead the market in sustainable computing products. The VIA Green Computing Initiative is a natural extension of this philosophy of developing environmentally friendly products, and covers a range of computing strategies, each aimed at highlighting different aspects of environmental responsibility.
VIA pioneered lead-free x86 processors, being first to market with RoHS-compliant processors in 2003. VIA’s entire silicon portfolio was RoHS-compliant by 2005, and achieved lead-free and halogen-free status by 2008. In addition, VIA has also received the IECQ certificate of Hazardous Substance Process Management (HSPM) in conformance to QC 080000 IECQ HSPM in 2008. The certification marks VIA's ongoing efforts in reducing hazardous substances and improving green manufacturing processes. |
| About VIA Technologies, Inc. |
| VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA's global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world's top OEMs and system integrators. www.via.com.tw |
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