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ODM Service – VIA Completes Your Embedded Solutions

Custom Board Design, Building the Next-Generation of Devices, One Piece at a Time

Many products in the VIA Embedded portfolio employ a modular design strategy that gives our customers the freedom to easily customize and modify existing designs, using fewer resources to create new and exciting devices in much faster design cycles,.

Products using Mini-ITX, Pico-ITX and Em-ITX form factors work with application specific expansion modules, opening a wealth of design possibilities.

Make use of VIA's COM Express Module value-added services for custom design and manufacturing for your own application-ready platforms.

Custom System Design, Build Your Own System Easier and Cost-effectively

Flexibility and faster time-to-market for the embedded market relies heavily on the support from the original manufacturer — applicable to all kinds of embedded computing applications. For developers, simple and cost-effective control of the project is the most important. Alongside the industry-leading x86 processors and core logic chipsets, plus small footprint and low power modes, developers can now also benefit from the creative solutions for system development from VIA Embedded.

VIA Embedded provides Platform Design & Manufacture Service (PDMS) to deliver tailor-made, reliability-trusted, integrated turnkey system for solution providers from product idea, industrial design, engineering specification, mechanical engineering to real product.

VIA PDMS is a complete integrated service package to provide quality platforms with fast and efficient deliveries.

 
The Way of VIA Embedded ODM Service
Planning & Consulting
Design concept evaluation
Proper design and specifications proposition
Global procurement
 
Manufacturing & Mass Production
Worldwide logistic supply
MTBF burn-in tests
Strict manufacturing control
Green computing qualification

Hardware & Software Development
Mechanical drawing
Board-level and system-level design
Rigorous validation testing
Well-structured software support for middle-ware & application level development
 
Technical Support & Post Sales Service
Responsive technical support from FAE team
Software development support
BIOS customization and VBIOS fine-tuning
 
The Whys and Wherefores Choosing VIA Embedded

Silicon Provider - CPU, Chipset and Companions

Complete platform provider with leading-edge core logic, processor, graphics, audio, networking, communications, multimedia and telecoms capabilities.
One-stop shopping for solution from component, board to system level.
Better solutions to avoid compatibilities concern with varied components.
Scalable CPU support for time, resources and cost saving. Flexibility on product positioning.
Strong backup and support in terms of silicon level.
Low level driver for Windows base and Linux, API and SDK middleware support to reduce the porting time on S/W.


Design Capabilities and Strength

Cost saving for customer engineering resources.
Thorough RD team including EE, BIOS, Mechanical, Thermal and EMI, etc.
Varied experiences on ODM design such as POS, Multimedia devices, Gaming, Entertainment, Lottery, Network appliance, Storage and Medical…
Customized design and could be any form factor based on VIA’s core logic solutions.
Robust validation on quality through widely testing such as functionalities, compatibilities, environmental verification, aging, vibration, shock and dropping… ensuring reliabilities.

Materials, Logistics and Support

Owner of core logic for major active components supporting longevity and flexibility on materials as turn key solutions.
Good relationship with key suppliers and experienced in materials preparation for unique and long lead-time parts.
Cost saving for customer materials maintenance reducing risk of inventory.
Warehouse in USA and EU providing real time support on buffer if needed.
Front-end Sales/FAE team providing timely support on technical issues.
Dedicated RMA team and service center located in Germany, US, Taiwan and China reducing turnaround time.